From Passive to Active to Flowing Liquid.
Cooling innovation at REDMAGIC has always been about breaking boundaries to elevate the gaming experience. While we used passive cooling in 2018, we knew that we were looking for more.
In 2019, we dared to do what no one else had tried: we built the world’s first internal turbofan inside a smartphone. This was the beginning of our active cooling journey. From air-cooling and massive vapor chambers to Liquid Metal, we have relentlessly chased the ultimate thermal equilibrium.
Today, with the REDMAGIC 11 Pro, we introduce the AquaCore Cooling System. For the first time, active flowing liquid cooling meets aerospace-grade mechanics, creating a level of heat dissipation never before seen in a smartphone.
The AquaCore cooling system
The AquaCore cooling system ensures extreme heat dissipation through a complete three-stage process.
In the heat absorption and conduction stage, the system uses Composite Liquid Metal 3.0 as a medium to instantly transfer heat from the core processor to the cooling structure.
In the heat spreading stage, AquaCore employs AI server-grade fluorinated liquid circulation and the industry’s largest 13,116 mm² 3D VC heat spreader to distribute heat in a three-dimensional, dynamic, and highly efficient manner.
Finally, in the heat exhaust stage, a waterproof turbo fan spinning up to 24,000 RPM generates powerful airflow, working with high-speed aerospace aluminum ducts to completely expel heat from the device, ensuring sustained peak performance under any extreme gaming load.
- Under-Screen Copper Foil
- Under-Screen High-Conductivity Graphene
- 13,116 mm² 3D Vapor Chamber
- Composite Liquid Metal 3.0
- Aircraft Grade Aluminum Alloy Mid-frame
- High-Thermal-Conductivity Gel
- Upgraded 24,000 RPM Waterproof Turbo Fan
- Motherboard Copper Foil
- High-Speed Aerospace Aluminum Air Duct
- Flowing Liquid Cooling
AquaCore Liquid-Cooling System Heat Dissipation Process
The Path to Liquid Metal
Gen 1 (REDMAGIC 1-5)
Standard thermal gel + Graphite.
Gen 2 (REDMAGIC 5S)
ICE Ag (Silver Plate) added for faster conduction.
Gen 3 (REDMAGIC 9S)
Frost cooling gel for 20% better efficiency.
Gen 4 (REDMAGIC 10/11)
Liquid Metal evolved from solid pads to semi-solid liquid metal for seamless thermal transference.
The Expansion: Spreading Heat Across the Surface.
From Design to Flow
Stage 1 (REDMAGIC 3)
Liquid cooling copper tube pipe for linear heat transfer.
Stage 2 (REDMAGIC 6)
VC heat Sink for planar (2D) heat transfer.
Stage 3 (REDMAGIC 8/9)
3D step VC for increased volume and surface area (10,182mm²).
Stage 4 (REDMAGIC 11)
Flowing liquid cooling moving from static conduction to active circulation.
The Release: Ejecting Heat Into the Air.
Fanning the Flames
v1.0 (REDMAGIC 3)
14,000 RPM fan with an IP55 rating.
v2.0 (REDMAGIC 5/6)
18,000 - 20,000 RPM fan with a metal cover to reduce noise.
v3.0 (REDMAGIC 9)
Shark fin vortex design for increased air pressure and reduced noise.
v4.0 (REDMAGIC 11)
24,000 RPM fan + waterproofing for the ultimate aerodynamic engine.
Freeze the Lag. Fuel the Victory. Icy tech for a fire experience.
The AquaCore cooling system delivers more than just looks—it brings a lasting, cool touch at your fingertips. It achieves comprehensive temperature control from the core to the surface, letting you say goodbye to overheating and enjoy peak performance without limits.
The powerful AquaCore cooling system efficiently manages heat, allowing the Snapdragon 8 Elite Gen 5 processor to completely overcome throttling, maintain sustained peak frequencies, and deliver a top-tier, lag-free and smooth gaming experience throughout your sessions.
Comfortable Grip: By efficiently moving heat away from the frame and screen using under-display graphene and a 3D VC, your hands stay cool even after hours of intense gaming.
Silent Power: Despite the record-breaking 24,000 RPM speed, our shark fin blade fan operates at a whisper-quiet 4dB, keeping you immersed in the game without the noise.




